This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b
Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo
General of machine: 1.The in line curing machine (ICM Series) is idea for high volume curing production.They are easy to integate with different Conformal Coating machines. 2.Available in different lengths,they provide the flexibility to match your
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
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