This unit is used as a buffer between SMD machines and/or testers. • SMEMA Interface • Conveyor and rack separately driven system • Rack driven by gear • 10 slots (45mm pitch) • RS-232C interface using SPI review PC &bu
FX-940 ULTRA 3D AOI - Nordson YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera, four side viewing cameras and 2D + 3D inspection, the FX-940 ULTRA
Introducing the industry's only true dual mode 3D SPI and AOI inspection system for the electronics manufacturing sector. The LineMaster Fusion combines the best of ASC's 3D SPI sensor technology along with cutting edge image-algorithm based AOI.
Conformal coatings used by electronic manufacturers contain UV indicators for the purpose of inspection. Since coatings are transparent, units must be viewed under black light in order to verify coverage and non-coverage. Quick set-up with Auto
The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3?), height repeatability (below 2µm at 3?), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg. http://www.sakiglobal.com/automated-optical-i
| 1 |
.gif)
