Videos: au and wire and bonding (Page 1 of 1)

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

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The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html

Finetech

Resin plug application and process

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With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr

Headpcb

TE Connectivity AMP New and Original 917805-2 in Stock  IC Bulk 20+    package

TE Connectivity AMP New and Original 917805-2 in Stock IC Bulk 20+ package

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TE Connectivity AMP New and Original 917805-2 in Stock  IC Bulk 20+    package 917805-2 Header and Wire Housing TAB 12-10 AWG 15 AU TPS57160QDGQRQ1 MSOP10 TI 20+ USB2244i VQFN36 Microchip 17+ PIC12C508A-04I/P DIP8 MICROCHIP 21+ LT8650SIV QFN-32

Shenzhen Fuwo Technology Co.,Ltd

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