Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
EMST Stallion PLC TT-JW is a new table top wave soldering machine from EMS Technologies, the soldering specialists. After the world wide success of the previous table top model, EMST Stallion, it is upgraded from manual controls to PLC based control
"The completely re-engineered HOTFLOW 3/20 reflow oven has been designed to deliver the BEST in CLASS results for ALL AREAS that ultimately affect the bottom line profit per PCB. The days of investing in just any reflow oven that has the number of he
The FlexSolder S3532 is the new High Speed Stamp Soldering machine. Although new, it is built on years of experience of soldering expertise using the proven Volumetric Stamp Soldering method. If you want to solder like Bosch and other world-wide lead
There is SPI for Screen Printing. AOI for Pick and Place. Now there is RPI (Reflow Process Inspection) for the Reflow Oven. KIC's RPI provides production reports such as yield analysis, DPMO, Pareto Charts, Cpk and much much more. When RPI is use
Universal Chip Programming with Precision Socket Actuator Lever. Precision High Volume Production Manual Programmer– the 2900L is a multisite manual production programmer ideal for volumes from 1K to 500K+ per year. BPM’s 2900L is excellent for small
ASSCON’s vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal f
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