During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. Cleaning the cavities is very difficult and small ball cavities can be damaged easily. XYZTEC ha
ScanCOMPONENT is a PC-based offline component programming system for the creation of vision data files from the smallest flip chip and bumped packages to the largest odd form devices. The ScanCOMPONENT is a standalone Product as well as a module of
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
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