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The KE302V is a 7th generation modular placement machine from Juki and represents the latest leading-edge technology for improved flexibility and production quality. It supports a hybrid feeder mix of electronic and mechanical feeders with up to 160
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
Swiftmode's Hyperclean Under Stencil SMT Wiper Rolls are the only product in the market that has beed developed specifically for the application. Best vacuum performance, less IPA usage and No loose fibres making the solder paste printing process mor
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
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Model GBW-60 Computer Control Cupping Testing Machine Applications: The Cupping testing Machine (Erichsen Tester) is precise technology testing machine which is used for thin sheet metal & strip steel rolled stock etc. It can complete test of pl
