Videos: bga bump (Page 1 of 1)

QFN Rework Using Polyimide Stencil

QFN Rework Using Polyimide Stencil

Videos

Video demonstrates easy to use leadless device rework process using polyimide stencil. This is the process described in IPC 7711/21 Procedure 5.8.1.1. and 5.8.1.2. For More Information Visit Our Site: http://www.solder.net/services/qfn-rework For

BEST Inc.

BEST manufactures and designs SMT stencils-both metal and plastic film type. This video demonstrates our metal stencil laser.

BEST manufactures and designs SMT stencils-both metal and plastic film type. This video demonstrates our metal stencil laser.

Videos

BEST manufactures and designs SMT stencils-both metal and plastic film type. This video demonstrates our metal stencil laser. See more on stencils here: http://www.soldertools.net/categories/Metal-Stencils/

BEST Inc.

BEST manufactures and designs SMT stencils-both metal and plastic film type. This video demonstrates our metal stencil laser.

BEST manufactures and designs SMT stencils-both metal and plastic film type. This video demonstrates our metal stencil laser.

Videos

BEST manufactures and designs SMT stencils-both metal and plastic film type. This video demonstrates our metal stencil laser. See more on stencils here: http://www.soldertools.net/categories/Metal-Stencils/

BEST Inc.

BEST manufactures and designs SMT stencils-both metal and plastic film type. This video demonstrates our metal stencil laser.

BEST manufactures and designs SMT stencils-both metal and plastic film type. This video demonstrates our metal stencil laser.

Videos

BEST manufactures and designs SMT stencils-both metal and plastic film type. This video demonstrates our metal stencil laser. See more on stencils here: http://www.soldertools.net/categories/Metal-Stencils/

BEST Inc.

NF120(200 nano resolution) X-ray Inspection System

NF120(200 nano resolution) X-ray Inspection System

Videos

#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application

SEC

ScanComponent

ScanComponent

Videos

ScanCOMPONENT is a PC-based offline component programming system for the creation of vision data files from the smallest flip chip and bumped packages to the largest odd form devices. The ScanCOMPONENT is a standalone Product as well as a module of

ScanCAD International, Inc.

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