Videos: bga corner bonding (Page 2 of 2)

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

Videos

Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an

PACE Worldwide

CSP rework on mobile phone board

CSP rework on mobile phone board

Videos

Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. The Fineplacer® core rework system handles all aspects of the rework cycle: http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html

Finetech

BGA Rework with ATCO model AT-707 BGA Rework Station

BGA Rework with ATCO model AT-707 BGA Rework Station

Videos

Demonstrates installation of a BGA component using the AT-707 BGA Rework Station. Features include split vision optics, software process control, and lead free reflow capable.

Advanced Techniques US Inc. (ATCO)

Fine Pitch QFP 208 Rework

Fine Pitch QFP 208 Rework

Videos

Demonstrates desoldering, solder paste printing, and installation of a fine pitch QFP 208 (30.6mm x 30.6mm) component using an ATCO model AT-GDP Placement & Rework Station.

Advanced Techniques US Inc. (ATCO)

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