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StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
Shenzhen Zhuomao Technology Co., Ltd. Specialized in BGA/SMT Rework, Reballing, SMD LED (LED Display Module) Repair, TV LCD Laser Repair, X-Ray Inspection Machine Since 2005. We design and development of customized Non-standard BGA Rework System in
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