Videos: bga solder balls warpage effect (Page 1 of 1)

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

LED Pick and Place Machine

LED Pick and Place Machine

Videos

LED Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt machine,LED Pick and Place Machine,LED Pick and Place,led pic

Dongguan Intercontinental Technology Co., Ltd.

BGA Solderability Testing 'Bob Willis How to Do It'

BGA Solderability Testing 'Bob Willis How to Do It'

Videos

Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als

ASKbobwillis.com

Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC

Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC

Videos

"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins

PACE Worldwide

Zhuomao ZM-R6821

Zhuomao ZM-R6821

Videos

1.The top heater can move freely along the X, Y axis in the IR preheating area It is good for many BGA chips distribution at different positions in the PCB board which need repair X-shaped infrared laser can do rapid location After location the elect

Shenzhen Zhuomao Technology Co., Ltd

CSP rework on mobile phone board

CSP rework on mobile phone board

Videos

Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. The Fineplacer® core rework system handles all aspects of the rework cycle: http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html

Finetech

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