Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
In the world of makers, people enjoy the fun of designing and developing hardware/ software, even final electronic products. They will not concentrate a lot on the cost and manufacturability. But it is quite different from lab to factory, when it com
AQUBE® L Series For process safe fine cleaning of assembled PCB’s and Hybrids The new kolb AQUBE® systems are next-generation cleaning systems – even more efficient, even more compact, easy to handle and
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
Demonstration of JTAG Live™ CoreCommander software. CoreCommander offers JTAG control of µprocessors, and DSPs via core debug access. The tool's routines take control of key processor core (e.g. ARM, PPC, X-scale, Cortex etc.) functions using the bui
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
The LeanCNCell is a production system designed to handle all metering and dispensing tasks for small and medium-sized batch production. Standard applications include applying or sealing of electronic assemblies and their housings with 1D, 2D or 3D co
