A brief demonstration of the ScanCAD Precision Material Removal System for PCB Reverse Engineering
used after automatic AOI; OK PCB in one magzine,NG PCB in anther magzine
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IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, has emerged as the preeminent authority for electronics assembly manufacturing worldwide. The standard describes materials, methods, and verification criteria fo
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In this video, you will know the bga rework machine how to hot air. After watched it, please give Joy Rong a " like", thank you for your support. Product Application 1.Desolder and solder all the BGA Chip, remove and repair different motherboard BGA
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Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
