ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
The CAM/ALOT 5000 Liquid dispensing system provides hign-speed adhesive or solder paste dispensing for applications involving large boards or multi-up panels: ● 25,000 dots per hour for 50 mil pitch solder paste ● 22,000 dots per hour for 3mm pi
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