H351 is a 5 axis soldering robot with X,Y,Z,R,and solering wire feeding motion system.It is equipped with 400W high frequency heating systerm with rapid heat recovery,soldering tip is easy to be exchange with low cost.Break-tin automatic solder wire
Features: 1. Desktop single table router speed 500mm / s. 2. High-quality shaft system allows the system to quickly increase and decrease, reduce the same period of time, improve productivity, while maintaining high accuracy. 3. Use high-quality ha
This video is designed to help packaging engineers, quality control managers and those tasked with preserving critical parts in enclosed spaces for storage and usage. The video will highlight different features and benefits of the Moisture Hog desic
Intrinsic Quality is pleased to offer a variety of Test Fixture Development Services that include fixture building, tester interface building, harness building, troubleshooting, maintenance, design, and engineering. IQ’s fixtures are built to exactin
The XRHCount is the leading contactless SMD-counting device using X-ray technology. Seamless integration to all common ERP/MES and traceability system ensure data availability. With a counting speed under 10 seconds per reel the system causes an extr
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
Welcome to this Defect of the Month video on monitoring flux application for wave and selective, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the l
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
