Our Global Sales Manager Dirk Schade introduces the Condor Sigma Lite at SMT/Hybrid/Packaging 2013 in Nürnberg, Germany. A bond tester that can grow with your company. Put it to the test! For more information, go to www.xyztec.com https://www.xyztec
Example of Digitaltest's MTS 500 Condor system on a pcb panel.
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. Cleaning the cavities is very difficult and small ball cavities can be damaged easily. XYZTEC ha
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