AOI technology has been proven as highly efficient for PCB manufacturing process improvement and quality achievement. EKT strives to be your most reliable AOI supplier. cathysun@ekt-tech.com mb/wechat: +86-18320811289
Best in class productivity The DECAN F2 next-generation high-speed universal chip mounter, provides the highest productivity and mounting accuracy in its class. The modular conveyor allows Optimal PCB flow and it is possible to convert to large board
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
Inspection items: missing parts, extra parts, offset, skew, sideways, wrong polarity, damage, color deviation etc. cathysun@ekt-tech.com mb/wechat: +86-18320811289
ScanINSPECT BGA uses an intuitive process flow interface integrated with a high resolution, 2-D image-processing unit. This combination allows 100% inspection of ball placement on BGAs, in or out of trays (JDEC, etc.). This is Part 1: How to progr
Introduction to the Unitech UC-250M-CV PCB Cleaner. Multi-stage in-line bare PCB surface cleaner. Brush/vacuum, rubber roller/sticky paper, & Ionized air blower.
Introduction to the Unitech UC-250M-CV PCB Cleaner. Multi-stage in-line bare PCB surface cleaner. Brush/vacuum, rubber roller/sticky paper, & Ionized air blower.
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
