General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Nano-copper sintering in formic acid vapor.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
General of machine: 1.The in line curing machine (ICM Series) is idea for high volume curing production.They are easy to integate with different Conformal Coating machines. 2.Available in different lengths,they provide the flexibility to match your
General of machine: 1.The in line curing machine (ICM Series) is idea for high volume curing production.They are easy to integate with different Conformal Coating machines. 2.Available in different lengths,they provide the flexibility to match your
General of machine: 1.The in line curing machine (ICM Series) is idea for high volume curing production.They are easy to integate with different Conformal Coating machines. 2.Available in different lengths,they provide the flexibility to match your
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