The KE302V is a 7th generation modular placement machine from Juki and represents the latest leading-edge technology for improved flexibility and production quality. It supports a hybrid feeder mix of electronic and mechanical feeders with up to 160
Data I/O's premier automated programming system PSV7000 with tray to tray integrated media I/O option for semiconductor devices
Semi-automatic press-fit machine and tooling for high speed connectors, including SFP, SFP+, SFP28G, XFP, QSFP+, QSFP28G, and MiniSAS HD series. Learn more on http://www.nextrongroup.com/Press-fit... Connect with us on http://www.nextrongroup.com/ ?
Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards.
https://bpmmicro.com/3928-7-site-aps/ The 3928, with up to seven sites, is made for programming large data devices, such as MCUs, eMMC HS400, NAND, NOR and Serial Flash devices. High-speed signals support devices up to 200 Mhz and the latest eMMC
Small Pick and Place factory, contact talia@zidatek.com http://www.zidatek.com/ http://www.zida-ele.com/
Small Pick and Place factory, contact talia@zidatek.com, http://www.zidatek.com/ http://www.zida-ele.com/
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
In this video, you will know the bga rework machine how to hot air. After watched it, please give Joy Rong a " like", thank you for your support. Product Application 1.Desolder and solder all the BGA Chip, remove and repair different motherboard BGA
1.The top heater can move freely along the X, Y axis in the IR preheating area It is good for many BGA chips distribution at different positions in the PCB board which need repair X-shaped infrared laser can do rapid location After location the elect
