General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Precise coating discrete dots with the DispenseJet DJ-9500. http://www.nordsonasymtek.com
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
The following video guides the user through a typical data collection process. These steps may vary depending on the process your company uses. Categories: WaveRIDER, WaveRIDER SPC (v5.2x)
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
Adding ALPHA® solder preforms to solder paste can result in complete hole fill in electronic assembly pin in through hole soldering applications. www.alpha.alent/products/preforms
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