General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
03006399-01 HOSE 6x4 Reject Placement Circuit 03006400-01 HOSE 8x5 Stop Circuit 03006405-01 DISTRIBUTOR APPLICATION HEAD COMPL. 03006411-02 CONTROL UNIT TAPE CUTTER HF 03006414-01 progr. FLASH CONTROL UNIT HF/X-Series 03006457-02 CALIBRATION UNI
03006317-01 QUICK RELEASE FASTENER QS-G1/8-8-I 03006318-01 QUICK RELEASE FASTENER QS-G1/8-6-I 03006381-01 HOSE 6x4 HOSE 6x4 Placement Circuit 03006383-01 HOSE 12x8 AIR 03006399-01 HOSE 6x4 Reject Placement Circuit 03006400-01 HOSE
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
03003704S01 Cooling Hose w. Mounting, Siplace HF 03003706-02 TRAILING CABLE SIPLACE HF 03003717-01 FILTERELEMENT 40um 03003719-06 BOX 03003725-03 EMTY TAPE GUIDE WITH COMP. EJECT 03003745-01 Scale X-Axis Siplace HF 03003748-01 READ HEAD Siplac
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