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Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method.

Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method.

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Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com

ASYMTEK Products | Nordson Electronics Solutions

Dam and Fill with dual valves. Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity.

Dam and Fill with dual valves. Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity.

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Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com

ASYMTEK Products | Nordson Electronics Solutions

Spectrum II - Solder Paste Dots & Lines

Spectrum II - Solder Paste Dots & Lines

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With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su

ASYMTEK Products | Nordson Electronics Solutions

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