Flip Chip Thermosonic Bonding with the FINEPLACER® pico MA. http://eu.finetech.de/micro-assembly/products/fineplacerr-pico-ma.html More information about Thermosonic bonding: http://eu.finetech.de/micro-assembly/technologies/ultrasonic-thermosonic-b
PC-Controlled Rework. Easy to use, compact rework station is the perfect system for those who are ready to move up from manual, hand rework. With controllable profiles, it uses precision hot air from the top and a fast acting IR underheater. Handle
A unique rework system that combines IR radiation with convection heating. Large area pre-heater (bottom heater) provides unmatched temperature uniformity. Available in a standard configuration, as well as an extended base system capable of handling
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