MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.
ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
Seika Machinery has introduced a line of unique, cutting-edge new Green Technology products to address customer requirements for recycling, energy conservation, renewable resources and cost-cutting systems. We will continue to seek out new equipmen
Those were the Scheugenpflug TechDays 2017! https://www.scheugenpflug.de/en/news/press-releases/article/scheugenpflug-techdays-2017-with-record-attendance-123.html From potting batteries and electric engines to new, high temperature resistant potti
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
611 Hollingsworth Street
Grand Junction, CO USA
Phone: (970) 245-0408
