Nano-copper sintering in formic acid vapor.
ASSCON’s vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal f
The modern design of the machines and the physical laws of the process permit to defect-free soldering of the most complicated SMT assemblies even with lead-free solder pastes. The machines are particular suited for users who process product with fr
The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are proces
The Solderstar Pro - The only profiling datalogger you will ever need.
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