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VIGON® UC 160

Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer

ZESTRON Americas

VIGON® RC 303

Videos

VIGON® RC 303 is a water-based cleaning agent specifically developed to remove all types of baked-on flux residues from reflow ovens and wave solder systems. Also, it removes re-condensed fluxes and emissions from condensation traps and heat exchange

ZESTRON Americas

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