Substrate processing:
Maximum substrate size (XxY): 609.6mmx508mm(24”x20”)
For circuit boards larger than 20”, special fixtures are required
Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Video demonstrates easy to use leadless device rework process using polyimide stencil. This is the process described in IPC 7711/21 Procedure 5.8.1.1. and 5.8.1.2.
For More Information Visit Our Site: http://www.solder.net/services/qfn-rework
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