· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
ATRON® SP 200 is a water-alkaline surfactant cleaner, specifically developed to remove baked-on fluxes from solder pallets and condensation traps. ATRON® SP 200 can be used for the removal of unsoldered solder pastes from SMT stencils. The cleaner ca
Product name: Halogen Free Lead Free Solder Wire Product code: E9650-HF961 Alloy composition: Sn/Ag3.0/Cu0.5 Diameter: 0.2mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm Packing: 500g/reel, 1kg/reel (10kg/box) Price: Contact us for best price Features:
VIGON® RC 303 is a water-based cleaning agent specifically developed to remove all types of baked-on flux residues from reflow ovens and wave solder systems. Also, it removes re-condensed fluxes and emissions from condensation traps and heat exchange
The FlexSolder S3532 is the new High Speed Stamp Soldering machine. Although new, it is built on years of experience of soldering expertise using the proven Volumetric Stamp Soldering method. If you want to solder like Bosch and other world-wide lead
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
VIGON® SC 200, based on the MPC® Technology (Micro Phase Cleaning), is a water-based cleaning agent designed to clean SMT stencils at room temperature. The cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can
