Introducing the industry's only true dual mode 3D SPI and AOI inspection system for the electronics manufacturing sector. The LineMaster Fusion combines the best of ASC's 3D SPI sensor technology along with cutting edge image-algorithm based AOI.
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Mx400L has an IPC 9850 speed of 42,000 CPH. It will accomodate a PCB size up to 26.77" x 18.11", it has 6 module heads on the front gantry, 6 module heads on the rear gantry. minimum lead pitch is 15mil, and it will place parts down to 01005 (0402 me
Yamaha pick and place chip mounter machine I-pulse M10/M20 for more brands chip mounter machine, please view http://www.smdmachine.com
HIROSE New and Original GT8E-2P-DS in Stock Tray package HIROSE New and Original GT8E-2P-DS in Stock Tray package HIROSE New and Original GT8E-2P-DS in Stock Tray package FDS8884 FAIRCHILD FDV301N FAIRCHILD FDV303N FAIRCHILD FGH60N60SMD FAIRC
HIROSE New and Original GT8E-2P-DS in Stock Tray package HIROSE New and Original GT8E-2P-DS in Stock Tray package HIROSE New and Original GT8E-2P-DS in Stock Tray package FDS8884 FAIRCHILD FDV301N FAIRCHILD FDV303N FAIRCHILD FGH60N60SMD FAIRC
Yamaha pick and place chip mounter machine I-pulse M10/M20 for more brands chip mounter machine, please view http://www.smdmachine.com
Welcome to this Defect of the Month video on head in and on pillow, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years there hav
With the DEK NeoHorizon iX you can’t go wrong. With their advanced features, the new models provide a powerful and highly accurate solution for any application.
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
