Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Model name CM602-L Model NM-EJM8A Substrate size L 50 mm × W 50 mm ～ L 510 mm × W 460 mm High-speed placement head 12 nozzles Mounting speed 100 000 cph (0.036 s/chip) Mounting accuracy ±40 μm/chip (Cpk ≧1) www.smt11.cn Co
The most advanced ultrasonic stencil cleaning system! Clean solder paste, adhesives and flux residue in one machine Easy loading / unloading only 39" H Uses less chemistry Generates less wastewater Increased ultrasonic cleaning e
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