MPM UP 2000 HIE for sale,if you interested welcome to contact us soon. BOARD HANDLING Minimum/ 2" x 2" (50.0 mm x 50.0 mm) to Maximum size 20" x 16" (508 mm x 406 mm) (16" or greater board lengths require dedicated workholder) Thickness range
ITW EAE MPM Edison Printing System
2015 Europlacer iiNeo Auction December 1, 2016 www.xlineassets.com
TI New and Original ADS54J42IRMPT in Stock IC QFN , 17+ package ADS54J42IRMPT Dual-Channel, 14-Bit, 625MSPS Analog-to-Digital Converter (ADC) XC6SLX150-3FGG484C BGA XILINX 20+ XC6SLX100-3FGG484C BGA XILINX 14+ XC6SLX25-2FTG256C
TI New and Original UCC28C43DGK in Stock IC MSOP8 , 22+ package UCC28C43DGK -40°C to 105°C Operating Temperature, 20V, 1A, Low Power 1MHz Current Mode PWM Controller with 8.4V/7.6V UVLO 100% Duty Cycle XC6SLX150-3FGG484C BGA XILINX 20+ XC6S
TI New and Original TPS92624QPWPRQ1 in Stock IC HTSSOP20 ,21+ package TPS92624QPWPRQ1 Automotive Quad High-Side LED Driver with Heat Sharing XC6SLX150-3FGG484C BGA XILINX 20+ XC6SLX100-3FGG484C BGA XILINX 14+ XC6SLX25-2FTG256C
ON New and Original FGA30S120P in Stock IC TO-3PN , 21+ package FGA30S120P IGBT, 1300V, 30A, Shorted-anode XC6SLX150-3FGG484C BGA XILINX 20+ XC6SLX100-3FGG484C BGA XILINX 14+ XC6SLX25-2FTG256C BGA XILINX 21+ XC6SLX45-2CSG32
ST New and Original M27C2001-10F1 in Stock IC FDIP-32W , 21+ package M27C2001-10F1 2 Mbit (256Kb x 8) UV EPROM and OTP EPROM XC6SLX150-3FGG484C BGA XILINX 20+ XC6SLX100-3FGG484C BGA XILINX 14+ XC6SLX25-2FTG256C BGA XILINX 2
