ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
MPM UP 2000 HIE for sale,if you interested welcome to contact us soon. BOARD HANDLING Minimum/ 2" x 2" (50.0 mm x 50.0 mm) to Maximum size 20" x 16" (508 mm x 406 mm) (16" or greater board lengths require dedicated workholder) Thickness range
2015 Europlacer iiNeo Auction December 1, 2016 www.xlineassets.com
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