Model WDD, WDW，WDW-S, WDW-E, WDW-D Series Computer Control Electromechanical Universal Testing Machine Applications Computer Control Electromechanical Testing Machines are designed and manufactured according to ASTM, ISO, DIN, GB etc standards. I
JDSU TB-2310 TB2310 OC-48 Dual Wavelength (1310/1550nm) Package - See more at: http://www.testequipmentconnection.com/70878/JDSU_TB-2310.php#sthash.ByomqDH8.dpuf
Automation for Tracker Model 30, TrackerPXI and more A Huntron Access Prober is used to automate the testing of printed circuits assemblies (PCA) that would otherwise have to be tested by hand. Adding Flying Probe technology your test procedure wil
Bob Willis "How to Do It" video clip explains how to test solderability of terminations in a production environment in a few seconds. The test is simple and show if a process problem you are facing is related to process, components, paste or other fa
“The Ultimate Probing Machine”. Ultra Fast full Function Patented Double-sided, Closed Loop 22-probe System, All probes are Analog, Digital, Boundary Scan, and Vectorless Test enabled. Use it In-Line or manual operation with AOI capabilities. The
Rohde & Schwarz CMU200 Loaded with Options THIS UNIT INCLUDES OPTIONS: B12,B21,B54,B56,B68,B96,U99.U65,K16,K17,K20,K21,K22,K23,K24,K29,K42,K43,K47,K48,K53,K57,K58,K59,K61,K62,K63,K64,K65,K66,K67,K68 Rohde & Schwarz CMU200 Universal Radio Commun
Stinger90 is an off-line X-ray inspection and industrial CT system with the highest voltage of 90kV, which is designed for electronic industry. It can meet the needs of X-ray inspection of PCB, SMT, small electronic components, semiconductor packagin
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
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