Bob Willis "How to Do It" video clip explains how to test solderability of terminations in a production environment in a few seconds. The test is simple and show if a process problem you are facing is related to process, components, paste or other fa
PCB rejection is used for store the NG PCB, pass the OK PCB. NG board capacity: 5pcs. Panasonic PLC controller. More conveyor system machines, welcome to contact : E? sales@obsmt.com T:86-13926596436 (wechat/whatsapp)
Localization of high-power lasers accelerates, and development bottlenecks need to be broken Superpower lasers are characterized by small size, light weight, high electro-optic conversion efficiency, stable performance, high reliability and lon
By Pat McGoff, Market Development Manager During New Product Introduction (NPI), one of the priorities of both designers and manufacturers is quality. However, quality means something different to the designers and the manufacturers. Designers eq
At present, the low-power laser and the medium-power laser are gradually being localized, while the superpower lasers are just beginning to be localized and is accelerating. How to improve the reliability of superpower lasers welding is an urgent tec
Advanced Assembly offers services such as turn-key services, consignment or a combination of both. Advanced Assembly uses a patented BOM Builder in order to make sure there are no errors in your order, and provides quick-turn output by using an autom
This video shows how to use a mouse in CAM350. The GUI is also discussed as well as how to customize it. Custom toolbars and hot keys are demonstrated
Welcome to this Defect of the Month video on monitoring flux application for wave and selective, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the l
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
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