MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.
Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com
PCB Router Function: Used for routed PCB panel singulation with lower stress. PCB Router Advantages: Lower mechanical stress Precise tooling High quality of cuts Less dust PCB Router Specification: Model Number SMTR17
Data I/O's premier automated programming system PSV7000 with tray to tray integrated media I/O option for semiconductor devices
The VJ Electronix XQuik with AccuCount is designed to reduce time and manpower required for incoming inspection and cycle counting of electronic components. Simply place the component reel inside of the x-ray cabinet and press “COUNT”. There is no pr
http://www.ddmnovastar.com/selective-solder/low-to-medium-volume/ess-selective-soldering-machines - The ESS Selective Soldering Machines from DDM Novastar offer a new entry point in cost-effective, easy-to-operate, automatic batch selective soldering
Manual and semi-automatic ?CT inspection systems for small electronic components with measurements of voxel sizes around 15 -- 20 ?m. Depending on customer requirements the system can equipped with the most suitable x-ray tube and detector.
https://bpmmicro.com/3928-7-site-aps/ The 3928, with up to seven sites, is made for programming large data devices, such as MCUs, eMMC HS400, NAND, NOR and Serial Flash devices. High-speed signals support devices up to 200 Mhz and the latest eMMC
In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board. To get a quote or obtain more information on the IR 1000, visit the link below: https://www.paceworldwide.com/products/area-array-bga-rework/bga-r
Two stations, one for soldring and the another is for goods loading at the same time. So it doubled the production efficiency
