During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. Cleaning the cavities is very difficult and small ball cavities can be damaged easily. XYZTEC ha
A technology that identifies the intermetallic compound formation, enables the system to provide closed loop feedback to the operator and validates the condition of the solder joint. This technology works in conjunction with SmartHeat® and patented C
ProWorks Work Instruction Software in use at KMWE, Everett Charles Technologies, and Fluidic Systems.
Demonstrates installation of a BGA component using the AT-707 BGA Rework Station. Features include split vision optics, software process control, and lead free reflow capable.
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