Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. The Fineplacer® core rework system handles all aspects of the rework cycle: http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html
Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.
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