i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
See what some of our customers have to say about the complete PCB design environment offered by PADS 9.0. This next generation in PCB Design tool combines an intuitive, flexible design environment with integrated, scalable technology. Giving engine
Demonstration of JTAG ProVision from JTAG Technologies. The 2nd generation application development toolsuite from the world leading supplier of IEEE 1149.x boundary-scan solutions. To find out more go to: http://www.jtag.com
Flip Chip Thermosonic Bonding with the FINEPLACER® pico MA. http://eu.finetech.de/micro-assembly/products/fineplacerr-pico-ma.html More information about Thermosonic bonding: http://eu.finetech.de/micro-assembly/technologies/ultrasonic-thermosonic-b
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
