ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
20 MOhm voltage 250 Ohm current +/- 0.01 % Absolute accuracy error +/- 0.05 % of full scale +/- 0.1 % of full scale maximum Linearity error +/- 0.04 % Accuracy drift according to +/- 0.0025 % of full scale/â°C temperature Common mode rejectio
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