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High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon
Viscom AG
Sales manager: Mac Xie Mobile: +8618020714662(WhatApp) Email: at@mooreplc.com Skype: +8618020714662 Product Detail Flexible ModPack I/O configuration Analog, digital, serial, counter ModPacks 2 ModPack interfaces on a 3U board 8/16 bit dat
MOORE Automation Ltd.
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