QFN stenicl bumping process demonstrated using a polyimide stencil. This process is one in which a stencil is used to the bump the bottom terminations of a leadless device making it simple to place without voiding of the the thermal pac or shorting o
![[SEC] 3D In-line AXI Solution X-eye 6300 X-ray Inspection Machine](https://img.youtube.com/vi/w-_v-XDRKro/sddefault.jpg)
3D In-line Automated X-ray Inspection system (machine) Model: X-eye 6300 X-ray Tube: 160kV / 500 µa Table Size: Max. 330 x 250mm Min. 50 x 50mm Detector: 12 inch FPXD Defection type (Application): BGA, PoP, chip, QFN, QFP, etc. - High-speed In-lin
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
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