The Model 1550 Stencil & Pallet Cleaner is our most popular semi-automatic system. It is designed to clean stencils up to 29" x 29" (740 x 740 mm) and fully equipped with the following integrated options: Heated Wash Tank Filter Recirculator
The most advanced ultrasonic stencil cleaning system! Clean solder paste, adhesives and flux residue in one machine Easy loading / unloading only 39" H Uses less chemistry Generates less wastewater Increased ultrasonic cleaning e
ATRON® SP 200 is a water-alkaline surfactant cleaner, specifically developed to remove baked-on fluxes from solder pallets and condensation traps. ATRON® SP 200 can be used for the removal of unsoldered solder pastes from SMT stencils. The cleaner ca
LSMO-105 fastest and most reliable stencil inspection machine www.aoivision.com
VIGON® SC 200, based on the MPC® Technology (Micro Phase Cleaning), is a water-based cleaning agent designed to clean SMT stencils at room temperature. The cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can
The Mounter Nozzle Cleaner cleans 20 nozzles at a time. With the system, ultrasonically-vibrated water thoroughly passes through every nozzle opening. Double-cleaning power is generated with ultrasonic-energy cleaning and simultaneous vacuum suction.
Introduction to the Unitech UC-250M-CV PCB Cleaner. Multi-stage in-line bare PCB surface cleaner. Brush/vacuum, rubber roller/sticky paper, & Ionized air blower.
Introduction to the Unitech UC-250M-CV PCB Cleaner. Multi-stage in-line bare PCB surface cleaner. Brush/vacuum, rubber roller/sticky paper, & Ionized air blower.
Solvent-based cleaning medium for SMT stencil printer wipe systems ZESTRON® SW is a solvent-based cleaner with a high flash point, specifically designed for use in SMT printers without vacuum drying. With reproducible cleaning results and residue-fr
Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer
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