YAMAHA placement machine-YS24 equipment parameters: 1. Target substrate: L50×W50mm～L700×W460mm 2. Mounting capacity: 72,000CPH (0.05sec/CHIP) 3. Mounting accuracy: ±0.05mm(μ+3σ), ±0.03mm(3σ) 4. Target
YAMAHA placement machine-YS24 equipment parameters: 1. Target substrate: L50×W50mm～L700×W460mm 2. Mounting capacity: 72,000CPH (0.05sec/CHIP) 3. Mounting accuracy: ±0.05mm(μ+3σ), ±0.03mm(3σ) 4. Target
YAMAHA placement machine-YS24 equipment parameters: 1. Target substrate: L50×W50mm～L700×W460mm 2. Mounting capacity: 72,000CPH (0.05sec/CHIP) 3. Mounting accuracy: ±0.05mm(μ+3σ), ±0.03mm(3σ) 4. Target
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
FUJI-XP-243E 1. Multifunctional, high-speed, high-precision, compact design holographic small universal placement machine; 2. Mount 0603 (0201) chip; 3. Expand the number of nozzles stored, and you can always have nozzles or mechanical fixtures
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
The Vortik VPm Progressive Cavity Pump dispensing two-component materials for encapsulation.
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