Videos: temoving underfill from a chip (Page 1 of 1)

Flux spray coating on PCB with DispenseJet DJ-2200

Flux spray coating on PCB with DispenseJet DJ-2200

Videos

Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.

ASYMTEK Products | Nordson Electronics Solutions

Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method.

Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method.

Videos

Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com

ASYMTEK Products | Nordson Electronics Solutions

Spectrum II - Solder Paste Dots & Lines

Spectrum II - Solder Paste Dots & Lines

Videos

With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su

ASYMTEK Products | Nordson Electronics Solutions

Precise coating with the DispenseJet DJ-9500

Precise coating with the DispenseJet DJ-9500

Videos

Precise coating discrete dots with the DispenseJet DJ-9500. http://www.nordsonasymtek.com

ASYMTEK Products | Nordson Electronics Solutions

CSP rework on mobile phone board

CSP rework on mobile phone board

Videos

Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. The Fineplacer® core rework system handles all aspects of the rework cycle: http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html

Finetech

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temoving underfill from a chip searches for Companies, Equipment, Machines, Suppliers & Information

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