Videos: transfer beam (Page 1 of 1)

Universal Instrument Model GC30s Nov 7 2016

Universal Instrument Model GC30s Nov 7 2016

Videos

SMT, Pick and Place, Universal Instruments, Juki, Panasonic Factory Automation, Chipshooter, Lightning head, PCB, Reflow Oven, Model GC30s

Capital Equipment Exchange

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

Videos

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html

Finetech

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

Videos

Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an

PACE Worldwide

CSP rework on mobile phone board

CSP rework on mobile phone board

Videos

Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. The Fineplacer® core rework system handles all aspects of the rework cycle: http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html

Finetech

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

Videos

Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an

PACE Worldwide

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SMT feeders

Easily dispense fine pitch components with ±25µm positioning accuracy.
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Software for SMT placement & AOI - Free Download.
High Throughput Reflow Oven

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