LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
Humitector™ Type 2 Humidity Indicator Card, used together with a Desi Pak® desiccant, can help provide a complete history of a dry pack environment for moisture sensitive surface mount devices (SMD's) (MSD - moisture sensitive
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
http://www.ddmnovastar.com/pick-and-place - DDM Novastar manufactures a selection of benchtop and free standing surface mount placement equipment for use in automatic and manual SMT PCB assembly . This equipment is specifically designed for facilitie
http://www.ddmnovastar.com/pick-and-place - DDM Novastar manufactures a selection of benchtop and free standing surface mount placement equipment for use in automatic and manual SMT PCB assembly . This equipment is specifically designed for facilitie
http://www.ddmnovastar.com/pick-and-place - DDM Novastar manufactures a selection of benchtop and free standing surface mount placement equipment for use in automatic and manual SMT PCB assembly . This equipment is specifically designed for facilitie
SMT pick and place machine for prototype to low volume PCB assembly. Features software guidance, programming via CAD data transfer, loose parts handling, and camera vision.
Compact and optimised for simple Gluing and Dispensing Tasks The DesktopCell is a compact, integrated solution for small to medium-sized batches and for prototype production. It unites all the advantages of a fully fledged dispensing cell and a smal
The LeanCNCell is a production system designed to handle all metering and dispensing tasks for small and medium-sized batch production. Standard applications include applying or sealing of electronic assemblies and their housings with 1D, 2D or 3D co
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