This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl
Filled Fluxing Underfill Product
(Albany, NY) 1/2/2018 – YINCAE Advanced Materials has recently developed a reflowable (no flow) underfill: SMT 160. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT p
PPM 5000 Dispensing System for Large PCB up to 36" x 60". Wide range of pumps available to dispense Solder Paste, Epoxy, Underfill. Inspection available for some applications. Custom built to your requirements.
PPM 5000 Dispensing System for Large PCB up to 36" x 60". Wide range of pumps available to dispense Solder Paste, Epoxy, Underfill. Inspection available for some applications. Custom built to your requirements.
http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process
More Product Information: EN: http://www.essemtec.com/en/products/dispensing/tarantula/ DE: http://www.essemtec.com/produkte/smt-dosieren/tarantula/ Introducing - The Tarantula - State of the art technology, easily integrated in any line. Wide range
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
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