General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
This is a brief functional demonstration of the Xylon Cheetah X-ray. The video shows the machine x-ray components on a pcb. In the video, you can see wire bonds and solder voids. This 2011 Cheetah is available at the Capital Equipment Exchange.
Semi-automated, programmable X-ray inspection system with multi-axis for prototyping, failure analysis, manufacturing process validation and rework verification for PCBs up to 18 x 20". The XT-3 is a high quality high-resolution manual x-ray inspecti
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
