This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
The LPKF ProtoFlow S reflow oven, with lead free capability, has significant advantages over previous models and rich features including a PC control software package. Learn more: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/solder
A white board explanation of how KIC's automatic profiling works. Animation is in English.
PACE’s Arm-Evac® 150 captures hazardous fumes locally and is suitable for benchtop soldering and electronic rework applications including handheld machining operations and light, limited use of solvents, adhesives and other light and medium duty indu
Beyond the hype, what hat does 'smart' technology do for the customer? Bjorn Dahle, CEO at KIC joins SCOOP's Philip Stoten to explore how value can be delivered and the importance of deep domain expertise to optimize processes and inform production b
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
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