Inline UV PCB Laser Depaneling Machine Inline UV PCB Laser Depaneling Instruction: PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Motorized version ASCEN taped component axial lead forming machine AS-809F axial lead former, use for cut and bend axial components braid resistor,capacitor, inductor, diode and other ele
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Motorized version ASCEN taped component axial lead forming machine AS-809F axial lead former, use for cut and bend axial components braid resistor,capacitor, inductor, diode and other ele
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Motorized version ASCEN taped component axial lead forming machine AS-809F axial lead former, use for cut and bend axial components braid resistor,capacitor, inductor, diode and other ele
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Cut and bend machine for taped axial components. axial component lead former be often used the axial resistance and diode. This is the motorized type former, you can use this axial lead f
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Cut and bend machine for taped axial components. axial component lead former be often used the axial resistance and diode. This is the motorized type former, you can use this axial lead f
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50mm to 368 x 4
03012203S01 C+P Head sleeve 12 star, modified for placement of comp. up 10.7mm. 03012357S01 LEAF SPRING / TAPE INPUT X 8 03012415S01 C+P head sleeve 6 star, modified for placement of comp. up 10.7mm. 03012416S01 LEAF SPRING / TAPE INPU
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