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2 white residue from ipa cleaning results

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VIGON® UC 160

Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer

ZESTRON Americas

VIGON® RC 303

Videos

VIGON® RC 303 is a water-based cleaning agent specifically developed to remove all types of baked-on flux residues from reflow ovens and wave solder systems. Also, it removes re-condensed fluxes and emissions from condensation traps and heat exchange

ZESTRON Americas

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IPC Certification Training from the comfort of your home or office. See our 2024 Training schedule now.

Circuit Board, PCB Assembly & electronics manufacturing service provider

Stencil Printing 101 Training Course

Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.

Best Reflow Oven

TIM & Thermal Gap Filler Dispensing - Download our new guide for process considerations and popular configurations.

design with ease with Win Source obselete parts and supplies

Affordable inventory, manufacturing and order management software. Try SOS Inventory 2 weeks for free, no credit card req.